MINILED Laser Rework System

 In the dense packaging of the MiniLED display module, the PCB substrate is arranged with thousands to tens of thousands of MiniLEDs, of which the size of a single MiniLED is ≤ 200um. Due to the dense distribution of Mini-LEDs, the use of hot air welding to do defective rework leads to MiniLED repair efficiency being low, the single chip rework is not favorable, MiniLED laser thermostatic rework system is a good solution to this defect.

       Product description

 

 In the dense packaging of the MiniLED display module, the PCB substrate is arranged with thousands to tens of thousands of MiniLEDs, of which the size of a single MiniLED is ≤ 200um. Due to the dense distribution of Mini-LEDs, the use of hot air welding to do defective rework leads to MiniLED repair efficiency being low, the single chip rework is not favorable, MiniLED laser thermostatic rework system is a good solution to this defect.

 

  Main application

 

  Downstream cell phone, panel and

 

  commercial display manufacturers

 

  In MiniLED Rework Process Laser

 

  Repair Soldering Application

 

  RGB MiniLED PCB Substrate

 

  Product specifications


model   number

LWH-FDL-FB12-K

Laser   wavelength

915/976±3nm

Spot   size

Hundreds   of spot sizes available

Temperature   range

100-400

control   method

PC   control, temperature feedback

Power   supply

AC220V/50Hz

 


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