Laser micro-machining technology utilizes the interaction characteristics between laser beams and materials (including metals and non-metals) to perform cutting, welding, surface treatment, drilling, and micro-processing.
Product Description:
Laser processing represents a crucial application in the laser industry. Compared to conventional mechanical machining, laser processing offers superior precision, accuracy, and speed. This technology utilizes the interaction characteristics between laser beams and materials (including both metals and non-metals) to perform various processes such as welding, cutting, marking, drilling, heat treatment, and forming. The unique properties of lasers make them ideal tools for micro-processing, widely applied in three major fields: microelectronics, micromechanics, and micro-optics.
Laser micro-machining technology is a processing technique that leverages the interaction between laser beams and materials (including metals and non-metals) for cutting, welding, surface treatment, drilling, and other micro-machining applications.
Key Features:
The cutting head features adjustable collimation in the XY direction, a precision manual focusing mechanism, full-body water cooling for heat dissipation, a completely sealed internal structure, and a drawer-type design for easy replacement. The optical system incorporates a multi-lens diffraction-limited design and includes nozzle components.
Main Applications:
In the PCB industry, it is primarily used for laser depaneling, such as cutting FR4, reinforcement steel sheets, FPCs, rigid-flex boards, and fiberglass boards with UV lasers.
For UV laser cutting of ultra-thin metal materials (thinner than 0.2mm), including copper foil, aluminum foil, stainless steel, and alloy materials, the process delivers burr-free, low-carbon, and distortion-free results, enabling precision cutting. This is commonly used in military components, photovoltaic copper foils, and related industries.
For film materials such as PET, PI, and other transparent films, UV laser cutting can directly process these materials. Typical applications include PET film cutting, as well as etching conductive metal-coated films, including constantan, copper, aluminum, ITO, silver paste, and FTO films.
Product Specifications:
Parameter | Specification |
---|---|
Model | LCH-Z355F77NE |
Laser Wavelength | 355/532nm |
Laser Power | 300W |
Clear Aperture | ≤26mm |
Focal Length | 75mm |
Focus Spot Size | ≤10μm |
Horizontal Collimation Adjustment | ±1.5mm |
Vertical Focus Adjustment | ±7mm |
Nozzle Diameter | 0.5-2mm |
Maximum Cutting Gas Pressure | 25bar |
Maximum Cutting Depth | 3mm |
Maximum Power Capacity | 1000W |
Contact: Mr.Xiao
Phone: +86-13385280662
E-mail: market001@whlaser.cn
Add: Room 02, Floor 5, Building 9, Gezhouba Sun City, No. 40, Gaoxin 4th Road, Donghu New Technology Development Zone, Wuhan