The Ultimate Guide to How Laser Solder Wire Welding Works

The Ultimate Guide to How Laser Solder Wire Welding Works

Laser soldering wire welding is a technique that utilizes laser as a heat source for soldering. The fundamental principle involves generating a highly concentrated beam of light through a laser device, converting the light energy into thermal energy to melt the solder and achieve the soldering. The specific process is as follows:

Automatic Wire Feeding Mechanism + Laser Soldering Head Diagram

1. Preheating: During the preheating stage, the laser emits a focused beam onto the metal pad to be soldered. The laser radiation preheats the pad, raising the temperature of the soldering point.

2. Feeding Solder Wire: While the pad is being preheated, the solder feeding device delivers the solder wire to the pad location.

3. Melting the Solder: Once the pad reaches a sufficiently high temperature, the laser continues to irradiate, rapidly      melting the solder wire and allowing it to flow into the tiny gap between the pad and the component being soldered.

4. Forming the Solder Joint: The solder wire is retracted to detach from the joint, and the laser gradually diminishes until it shuts off, completing the solidification and cooling of the solder joint.

Animated Demonstration of Laser Wire Soldering on Rectangular Pads

The precise execution of three key steps—material preheating, wire feeding/melting, and wire retraction—determines the perfection of laser wire soldering.

For example, when preheating PCB pads, temperature must be strictly controlled. Excessive heat can damage the pads and nearby components, while insufficient heat fails to achieve proper preheating. The wire feeding and retraction speeds must be fast—slow feeding may cause laser scorching on the PCB, while delayed retraction can lead to excess solder clogging the wire feeder nozzle.

The laser wire soldering system from Songsheng Optoelectronics integrates a real-time temperature feedback system, CCD coaxial positioning system, and a semiconductor laser. Equipped with self-developed intelligent soft soldering software, it supports importing multiple file formats.

The innovative PID online temperature regulation and feedback system ensures precise constant-temperature soldering, guaranteeing high soldering yield and accuracy. With wide applicability, it can be used for inline production or standalone processing.

Key Features & Advantages:

Desktop Laser Soldering System (Wire Feed + Temp Control) - Diagram

1. Non-contact soldering eliminates mechanical stress damage and minimizes thermal impact.

2. Multi-axis intelligent work platform (optional) handles various complex and precision soldering processes.

3. Coaxial CCD imaging for positioning and real-time monitoring ensures clear visibility of solder joints and automatic alignment correction, guaranteeing precision and automated production.

4. Proprietary temperature feedback system directly controls solder joint temperature and displays real-time soldering temperature curves, ensuring high yield rates.

5. Four-in-one coaxial alignment (laser, CCD, temperature measurement, and indicator light) solves the industry challenge of multi-optical path alignment and eliminates complex calibration.

6. Achieves 99% yield rate with solder joint diameters as small as 0.2mm and ultra-fast soldering per joint.

7. X, Y,  and Z-axis adjustability accommodates soldering for a wider range of components, enhancing versatility.

8. Compact benchtop design ensures easy mobility and operation.

Laser wire soldering features a compact structure and single-pass operation, producing plump solder joints with excellent pad wettability. It is particularly suitable for:

• PCB circuit boards

• Optical components

• Acoustic devices

• Semiconductor thermoelectric modules

• Other IC boards and individual electronic components.