What factors may lead to unsatisfactory laser soldering performance?

What factors may lead to unsatisfactory laser soldering performance?

Many microelectronics component companies conduct numerous sample tests when purchasing a laser soldering system. Why do they need to test so many times? Because the parameters obtained from the samples differ from those in actual automated production settings. The soldering process parameters required for welding one point are certainly not the same as those needed for welding 100 points.

First, it is important to understand that poor laser soldering results are not necessarily due to the equipment itself but may involve multiple factors. Below is a detailed analysis of this issue:

1. Improper Temperature Control: During laser soldering, the preheating and soldering temperatures of the pads must be precisely controlled. Excessive preheating temperature can oxidize the pads, leading  to poor solder wetting, while insufficient temperature may affect the solder's ability to spread properly.

2. Excessive Solder Feeding or Short Pin Legs: In automated      laser soldering, excessive solder feeding may cause the solder joint to form a ball shape, preventing the pin legs from protruding through the pad and thus affecting soldering quality. Additionally, excessively short pin  legs can lead to similar issues.

3. Incorrect Soldering Parameters: During laser soldering, parameters such as spot diameter, laser power density, and soldering speed significantly impact soldering quality. For example, a mismatch between the spot diameter and pad size, or laser power density that is too high or too low, can affect weld formation and quality.

4. Material Issues: Poor material quality can also lead to unsatisfactory soldering results. For instance, surface oxidation or impurities on the material can negatively impact soldering performance.

5. Soldering Stress and Deformation: Certain materials (such as copper and its alloys) have a high coefficient of thermal expansion and strong thermal conductivity, making them prone to significant deformation and stress during soldering, which in turn affects soldering quality.

6. Defects During Soldering:  Flaws such as cracks or pores can also affect soldering quality. These defects may be caused by excessive shrinkage stress before the solder fully solidifies or air entrapment during the soldering process.

7. Operator Skill Level: The proficiency of the operator also influences soldering results. Mastering equipment operation and the adjustment of soldering parameters is crucial to ensuring soldering quality.

In summary, poor laser soldering performance may stem from various factors, including equipment issues, parameter settings, material properties, environmental conditions, and operational practices. Therefore, when encountering unsatisfactory soldering results, a comprehensive investigation is necessary to identify and address the root causes. Additionally, measures such as enhancing equipment maintenance, improving operator skills, and optimizing process parameters can significantly improve laser soldering performance.

Features of Songsheng Optoelectronics Temperature-Feedback Laser Soldering System

1. Non-contact soldering – Eliminates mechanical stress damage and minimizes thermal      impact.

2. Multi-axis intelligent work platform (optional) – Adaptable to various complex and precision soldering processes.

3. Coaxial CCD camera positioning and real-time monitoring system – Clearly displays solder joints and enables immediate correction to ensure machining accuracy and automated production.

4. Proprietary temperature feedback system – Directly controls solder joint      temperature and displays real-time soldering temperature curves to ensure high yield rates.

5. Four-in-one coaxial alignment (laser, CCD, temperature measurement, and indicator      light) – Solves the industry challenge of multi-optical path alignment and eliminates complex calibration.

6. High precision and efficiency – Achieves a minimum solder joint diameter      of 0.2mm with ultra-fast soldering per point while maintaining a 99% yield rate.

The Songsheng Optoelectronics Constant-Temperature Laser Soldering System delivers continuous 976nm infrared laser output. Integrated with a CCD coaxial alignment system and a semiconductor laser, it supports multiple file formats for precise soldering. Thanks to its temperature feedback and CCD coaxial alignment capabilities, it ensures constant-temperature soldering and high-precision alignment for critical components, guaranteeing high production yield.

This system is ideal for:

• PCB spot soldering

• Metal/non-metal material soldering

• Sintering and heating applications

Its real-time high-precision temperature control makes it particularly suitable for highly sensitive, ultra-precision soldering processes.