Laser Soldering Technology in Connector Manufacturing

Laser Soldering Technology in Connector Manufacturing

China is the world's largest connector manufacturing base, where laser soldering has become a critical process technology in connector production. As connectors are essential components in virtually all electronic products, Songsheng Optoelectronics presents the following connector types particularly suitable for laser soldering.

RF Connectors

RF Connector Illustration

SMA Connector: As a coaxial connector utilizing miniature threaded coupling, this component demonstrates outstanding characteristics including broad operational bandwidth, excellent electrical performance, high reliability, and extended service life. It is primarily implemented in RF circuits of microwave equipment and digital communication systems for effective interconnection of RF cables or microstrip lines. The metal substrate design enables superior thermal dissipation, consequently imposing stringent requirements on both temperature control precision and heating efficiency during soldering processes. Laser soldering technology, with its advantages of high energy conversion efficiency, rapid solder melting, closed-loop temperature regulation, and exceptional welding temperature stability, fully satisfies these demanding joining applications.

Illustration: SMA Connector

SMP micro Connector (full name: Sub Miniature Push-on connector) is a high-frequency transmission component capable of providing reliable electrical connections. It is widely used in high-speed communication equipment, precision electronic instruments and aerospace  electronic systems that require extremely high signal transmission accuracy and stability. The laser solder ball welding machine enables micron-level precision soldering, ensuring consistent solder joint quality while perfectly meeting its demanding requirements for rapid heating and precise temperature control.

Universal Serial BUS Connector

Universal Serial Bus Connector Illustration

Type-C Interface: As a reversible USB connection standard, this compact and user-friendly interface is widely used in mobile phones, tablets, laptops and other electronic devices. During manufacturing, laser soldering is used for the soldering between fixed components and the housing. The 4-8 point soldering method can be selected to improve the compressive strength of the port, while achieving precise control of focal spot size and accurate positioning. This automated technology ensures high-precision and stable soldering quality.

Other USB Interfaces: Such as Type-A and Type-B interfaces involve multiple materials and delicate circuit layouts during manufacturing. Traditional soldering techniques face challenges including large heat-affected zones, difficulties in achieving precision soldering of micro-components, and inconsistent soldering quality. Laser soldering technology addresses these issues through precise control of soldering temperature and energy, ensuring uniformity and consistency of solder joints, improving connection stability, and guaranteeing data transmission security.

Other Precision Miniature Connector

FPC Connector Illustration

The FPC connector, designed for flexible printed circuit board connections, features ultra-fine pitch and high-density pin configurations that demand extreme soldering precision. Laser soldering technology, with its micron-scale focused spot and concentrated energy output, enables precise control over both soldering location and solder melt volume. This advanced process facilitates reliable soldering of micro-pitch surface-mount devices and chip components while effectively eliminating thermal impact on adjacent elements, thereby guaranteeing exceptional joint integrity and long-term connection reliability.

BTB Connector Illustration

The BTB (Board-to-Board) connector is a critical interconnect component widely used in mobile phones, tablets and other electronic devices to establish electrical connections between different circuit boards. Characterized by its miniature soldering areas and stringent precision requirements, this connector type particularly benefits from laser soldering technology. The process delivers micron-level accuracy and exceptional stability during soldering operations, guaranteeing optimal electrical conductivity and long-term connection reliability essential for high-performance electronic assemblies.

Connectors for Aerospace and Military Applications

Illustration of Aviation Connectors

High-Reliability Circular Connectors: In aerospace and military equipment applications, connectors are required to demonstrate exceptional reliability, stability, and environmental resistance. High-reliability circular connectors frequently employ laser soldering technology to ensure welding quality, meeting the demands for long-term stable operation in harsh environments.

Micro-Rectangular Connectors: Characterized by compact size, high density, and durability against repeated mating cycles, these connectors are widely used in aerospace and military communication systems. The high precision and non-contact processing attributes of laser soldering make it an ideal solution for micro-rectangular connector welding, guaranteeing both welding quality and consistency while enhancing connector reliability and service life.

Advantages of Laser Soldering in Connector Welding

High Welding Precision

• Micro-scale soldering capability: With a laser spot diameter achieving micron-level precision, this technology enables accurate soldering of miniature connector components such as 0.1mm pitch micro-spaced SMDs and chip elements. This ensures precise joint positioning and consistency, which is particularly critical for      high-density connector applications.

• Precise position control: Through advanced optical systems and precision motion control, the laser beam can be accurately directed to target soldering locations. This provides unique advantages for complex structural components and confined-space welding while preventing thermal impact on adjacent elements.

Minimal Component Damage

• Non-contact processing: As a non-contact welding method,  laser soldering eliminates physical stress on components and substrates while reducing thermal effects. This prevents deformation or damage common with traditional contact soldering, making it ideal for delicate or sensitive components like insulators and tail accessories in SMP micro-connectors.

• Small heat-affected zone: The localized heating characteristic enables rapid temperature rise while maintaining minimal thermal impact on surrounding areas. This effectively prevents performance degradation or damage to temperature-sensitive electronic components.

High Production Efficiency

• Rapid welding speed: The highly concentrated laser energy enables instantaneous solder melting and solidification, significantly reducing cycle times to meet mass production requirements.

• High automation capability: Laser soldering systems integrate seamlessly with automated production lines, reducing manual labor while improving consistency and stability, thereby lowering manufacturing costs.

Superior Welding Quality

• Exceptional joint consistency: The stable and precisely controlled laser output creates fully melted solder joints with dense microstructure, high mechanical strength, and excellent reliability - significantly extending product service life while maintaining uniformity  in pull strength, morphology, and internal structure across all joints.

• Defect prevention: Compared with conventional  methods, laser soldering substantially reduces defects including col joints, false soldering, and skipped joints, ensuring outstanding and consistent welding quality.

Characteristics of Songsheng Optoelectronics Laser Temperature-Controlled Soldering Systems

Illustration of Songsheng Optoelectronics Temperature-Controlled Laser Soldering System

1. The system delivers high-precision laser processing with a minimum spot diameter of    0.1mm, enabling soldering of micro-spacing surface-mounted devices and chip components.

2. Localized short-duration heating minimizes thermal impact on substrates and      peripheral components. Different heating profiles can be implemented according to component lead types to achieve consistent soldering quality.

3. Eliminating consumable soldering iron tips and heater replacements enables highly      efficient continuous operation.

4. Featuring micron-level laser spot precision with programmable duration/power      control, the system far surpasses traditional soldering irons in accuracy,      capable of soldering in spaces under 1mm.

5. Multi-optical-path coaxial design with CCD positioning provides "what-you-see-is-what-you-get" accuracy without repeated vision calibration.

6. Non-contact processing prevents stress-induced defects and eliminates static      electricity issues associated with contact soldering.

7. As a green energy source, laser offers the cleanest processing method with no      consumables, simple maintenance, and easy operation.

8. Ensures crack-free solder joints during lead-free soldering processes.