Laser Constant-Temperature Soldering for High-Precision Component Manufacturing

Laser Constant-Temperature Soldering for High-Precision Component Manufacturing

With technological advancements and the continuous trend toward miniaturization in manufacturing processes, traditional soldering methods based on conventional heat sources can no longer meet the requirements of current and future high-precision electronic device assembly. Laser soldering technology provides a groundbreaking solution to these challenges.

Laser soldering offers distinct advantages including compatibility with various solder materials, non-contact operation, and exceptional process flexibility. This technology has been widely adopted for applications such as:

• PCB board soldering

• FPC connector welding

• Surface-mounted component assembly

FPCB Board Pin header Soldering Case Study

For through-hole pin component soldering on PCBs, laser welding demonstrates exceptional thermal efficiency. Its rapid localized heating of pads and pins enables quick capillary action for solder wicking into holes. The integrated real-time temperature feedback ensures constant-temperature soldering without board damage, while the auto-alignment vision system compensates for pin position deviations.

Benchtop Temperature-Feedback Precision Laser Soldering System

Songsheng Optoelectronics Benchtop Temperature-Feedback Precision Laser Soldering System WH-LA80

The Songsheng Optoelectronics Benchtop Temperature-Feedback Precision Laser Soldering System enables synchronous automated wire feeding and tin melting during the soldering process. Through integrated system development, it provides customers with highly efficient and reliable laser soldering technology. The laser beam is transmitted and focused via fiber optics, continuously melting and spreading the fed solder wire onto workpiece pads to achieve high-precision, high-quality soldering for user products.

The system is primarily designed for micro-component soldering applications, including:

• Mobile phone speakers

• Micro motors

• Connectors

• Camera modules

• VCM components

• CCM components

• Mobile phone flex cable connections
  (Precision soldering of miniature components)

It accommodates solder wires with diameters of 0.5-1.2mm, featuring a compact wire feeding mechanism with convenient adjustment and smooth wire delivery.

Laser Constant-Temperature Soldering Process Diagram

This system is particularly suitable for high-precision soldering applications involving temperature-sensitive components or areas with heat-intolerant adjacent parts, thanks to its real-time high-precision temperature feedback control capability. Typical applications include:

• Localized soldering on high-density PCBs

• Precision sensor soldering in automotive electronics
  (Temperature-critical applications)

Key Features：

1. The system employs a semiconductor laser with low peak power, meeting the requirements for soldering low-melting-point filler metals such as tin.

2. Non-contact heat source with synchronized laser and wire feeding, small spot size, and minimal heat-affected zone, significantly reducing peripheral damage to solder joints.

3. Integrated self-tuning function automatically adjusts P, I, and D values through system feedback, ensuring precise temperature control and easier debugging.

4. To accommodate varying energy demands for different solder joints, the system supports programmable multi-segment temperature profiles, allowing different welding curves to be called within the same program.

5. The coaxial temperature control system provides real-time temperature feedback, monitoring and recording welding temperature curves throughout the process.

6. The infrared thermometer features an adjustable spot size, enabling better adaptation to solder joints of different dimensions.

7. Compact footprint, efficient heat dissipation, and high safety protection rating.

8. Low consumable usage, simple maintenance, and cost-effective operation.