Application Cases of Laser Soldering Technology in Precision Welding Processing

Application Cases of Laser Soldering Technology in Precision Welding Processing

Laser soldering technology offers numerous advantages, including non-contact processing, stress-free operation, pollution-free output, high precision, and high efficiency. Since only the soldering area is locally heated, the rest of the component remains unaffected by thermal influence, ensuring a more precise and reliable welding process. There are abundant application examples demonstrating its effectiveness in improving machining accuracy, particularly in the electronics industry, where it is highly favored for its precision, low thermal impact, and flexibility. Below are some specific cases.

1. PCB Soldering

Laser soldering technology addresses the shortcomings of traditional soldering methods in PCB applications, such as inconsistent solder joints and thermal damage. By precisely controlling heat input, it minimizes impact on surrounding components, significantly improving soldering quality.

2. Fine-Pitch Component Soldering

In applications requiring high-precision soldering, such as camera modules, laser soldering enables precise soldering of fine-pitch components, including chip-scale devices. Its highly focused beam allows soldering even with an ultra-small spot diameter as fine as 0.1mm.

3. Mobile Phone PCB Soldering

As components on mobile phone PCBs continue to shrink, soldering precision demands increase. Laser soldering systems, with their high automation level and ultra-fine focus, ensure accurate weld positioning, making them ideal for delicate soldering of miniature components inside smartphones.

4. IC and Semiconductor Soldering

Laser automated soldering technology is widely used in integrated circuits (ICs), semiconductors, and micro-sensors. Its high precision and efficiency meet the stringent requirements of these advanced manufacturing fields.

5. Photovoltaic Inverter Soldering

Laser soldering technology enhances the manufacturing and repair of photovoltaic inverters, improving their reliability and efficiency. It supports the development of solar energy storage systems, particularly for solder joints requiring high precision and consistency.

6. Sensor Manufacturing

Laser soldering plays a vital role in sensor production by optimizing product size and improving quality. Its precision enables reliable connections for delicate sensor components.

The laser soldering system typically consists of a wire feeding control system, motion platform system, closed-loop temperature control system, and high-speed pyrometer measurement system, enabling fully automated processes including wire feeding, laser soldering and post-weld inspection. Some advanced systems incorporate machine vision technology with CCD positioning to significantly improve product accuracy and yield rates while providing full-process visual monitoring capabilities.

Songsheng Optoelectronics Constant Temperature Laser Soldering System Workflow Diagram

The diagram illustrates the operational process of the laser constant-temperature soldering system: The computer software first configures the welding parameters and issues the soldering command. The laser module then emits a laser beam, which is directed through the semiconductor constant-temperature coaxial monitoring soldering head for processing. Simultaneously, the infrared pyrometer performs high-speed temperature measurement at the soldering point and feeds back the signal to the laser power controller. Utilizing high-speed PID algorithms, the laser power controller automatically adjusts the pumping source's laser output power to maintain precise temperature control during the constant-temperature soldering process.

Features of Songsheng Optoelectronics Laser Constant Temperature Soldering System:

1. Utilizes non-contact soldering technology, eliminating mechanical stress damage and minimizing thermal impact.

2. Equipped with a multi-axis intelligent work platform (optional), capable of handling various complex and precision soldering processes.

3. Integrated coaxial CCD camera positioning and processing monitoring system, providing clear visualization of solder joints and enabling real-time alignment correction to ensure processing accuracy and automated production.

4. Proprietary temperature feedback system that directly controls solder joint temperature while displaying real-time soldering temperature curves, ensuring high yield rates.

5. Four-point coaxial alignment of laser, CCD, temperature measurement, and indicator light - providing an innovative solution to multi-optical path alignment challenges in the industry while eliminating complex calibration procedures.

6. Achieves a minimum solder joint diameter of 0.2mm with 99% excellent yield rate, while significantly reducing single-point soldering time.

7. The X/Y/Z-axis configuration accommodates welding for a wider range of components, delivering broader application versatility.
        (Compatible with integration of various specifications of laser controllers and laser heads)