PCB Perfboard Pin Welding with Annular Beam Laser Technology

PCB Perfboard Pin Welding with Annular Beam Laser Technology

PCB Perfboard Pin Annular Laser Spot Soldering

  The annular laser spot effectively mitigates keyhole instability issues. The outer ring laser primarily functions to enlarge the keyhole opening, ensuring that minor fluctuations do not cause keyhole collapse or blockage. This significantly reduces spatter and greatly enhances process stability. Moreover, a larger outer ring spot diameter yields better results.

Laser soldering on PCB perfboards represents an advanced soldering technology.

Beam Diameter Specification for Annular Spot

Principle

  The process utilizes a high-energy-density laser beam to irradiate the contact area between the pin and the perfboard. The material rapidly absorbs the laser energy, converting it into heat, which causes the localized material to melt quickly, forming a strong solder joint. 

  The annular spot technology, developed by Songsheng Optoelectronic's R&D engineers, employs a specialized optical system to shape the laser beam into a ring-shaped distribution. This annular energy profile ensures more uniform heat distribution during soldering, significantly improving weld quality and process stability.

Advantages

1.       High Precision:
Laser welding enables extremely precise energy control and positioning, ensuring accurate soldering alignment between pins and the perfboard. This meets the stringent requirements of high-precision electronic manufacturing.

2.       Minimal Heat-Affected Zone (HAZ):
As laser welding is a localized heating process, thermal energy is concentrated precisely in the weld zone. This significantly reduces heat impact on surrounding PCB materials and electronic components, minimizing risks of thermal deformation and performance degradation.

3.       High Joint Strength:
Laser-formed solder joints exhibit superior metallurgical bonding with dense microstructure, providing excellent mechanical strength and electrical load-bearing capacity. This enhances the overall reliability of PCB assemblies.

4.       Automation Compatibility:
The process is ideally suited for automated production lines. It can be seamlessly integrated with robotic systems to achieve high-speed, batch welding operations, thereby improving production efficiency and reducing labor costs.

5.       Eco-Friendly Process:
Laser welding eliminates the need for flux or other chemical agents, preventing environmental contamination. This also avoids potential issues such as electrical performance degradation and corrosion caused by flux residues.