Applications of Solder Paste Laser Welding Technology in the Electronics Market

Applications of Solder Paste Laser Welding Technology in the Electronics Market

Efficient Applications of Solder Paste Laser Soldering Systems in Electronics Manufacturing

Solder paste laser soldering technology employs semiconductor lasers as its light source, typically operating at 976/980nm wavelengths. Unlike conventional solder paste processes, this method requires specialized laser-compatible solder paste. The technology utilizes optical lenses to precisely control and focus laser energy onto target solder joints, representing a non-contact heating soldering method.

Working Process and Applications of Solder Paste Laser Soldering Systems

The operational process of solder paste laser soldering machines begins with preheating the laser-specific solder paste. During this preheating stage, the target solder joints are simultaneously warmed. The applied high temperature then melts the solder paste into liquid tin, which thoroughly wets the bonding pads to ultimately form a reliable solder connection. This laser solder paste welding technology offers significant advantages including high energy density, excellent heat transfer efficiency, and non-contact operation. It accommodates both solder paste and wire feeding methods, proving particularly effective for precision soldering in confined spaces or micro-scale joints, as well as for high-reliability products requiring localized heating.

To address the growing demand for automated precision soldering in the electronics industry, Songsheng Optoelectronics' laser soldering equipment has seen rapidly expanding adoption across challenging applications. These include BGA external lead bumping, Flip Chip bump formation, BGA bump rework, TAB device lead interconnections, as well as components traditionally difficult to solder such as various sensors, inductors, hard disk drive heads, camera modules, VCM voice coil motors, CCMs, flexible printed circuits (FPC), optical communication components, connectors, antennas, speakers, micro-speakers, thermistors, and photosensitive elements. The technology's precision and reliability have made it increasingly indispensable for advanced electronic manufacturing.

Songsheng Optoelectronics Dual-X Dual-Y Dual-Station Solder Paste & Wire Feeding Soldering System

Advantages of Songsheng Optoelectronics Solder Paste Laser Soldering System

1. Temperature-Feedback Semiconductor Laser Welding System
   The temperature feedback function enables precise thermal control during soldering, allowing real-time temperature monitoring in micro-areas with diameters ranging from 0.3-1.5mm.

2. Multi-Station Welding System
   Featuring an 8-axis high-precision multi-station laser welding system, this solution integrates visual positioning with simultaneous solder paste dispensing and laser welding operations, boosting efficiency by over 20% while significantly increasing production capacity.

3. Precision Solder Paste Dispensing Mechanism
   Equipped with a high-accuracy solder paste dispensing unit, the system achieves ±0.02g dosing precision through programmable control, ensuring consistent solder volume deposition.

4. Vision Positioning System
   Utilizing automated image capture for customized welding paths, the system can acquire multiple feature points on a single product, dramatically improving both processing efficiency