Laser Soldering System Helps Improve Efficiency Component Welding

Laser Soldering System Helps Improve Efficiency Component Welding

With the rapid development of the information age, electronic component soldering has become a highly sought-after skill, and the soldering industry is flourishing across the Chinese market. Laser soldering equipment has entered the fast lane in China, becoming a common sight in major electronics factors.

The laser soldering system can fully replace manual labor, and its software allows precise adjustment of soldering positions as needed. Equipment with an  automatic wire-feeding mechanism, it delivers solder wire to the laser focus point based on program requirements , with adjustable wire diameter(0.3-1.0mm) and feeding force, complecting the melting process during laser processing.

Easy to operate—beginners can master it within two hours——it saves up to 80% of labor costs. For health and environmental benefits, lead-free eco-friendly solder wire is recommended.

Image of Automatic Wire Feeding Mechanism

Laser soldering consists of a real-time temperature feedback system, CCD coaxial positioning system, and semiconductor laser. It is equipped with independently developed intelligent soldering software that support importing multiple file formats.

The innovative PI online temperature soldering regulation and feedback system ensues precise constant-temperature soldering, guaranteeing high yield and accuracy. With broad applicability, it can be used for both in-line production and standalone processing

Image of Dual-X Dual-Y Dual-Station Solder Paste & Wire Feeding Welding Equipment

Features:

1. Non-contact soldering – Eliminates mechanical stress damage and minimizes thermal impact.

2. Multi-axis intelligent work platform (optional) – Handles various complex and high-precision soldering processes.

3. Coaxial CCD imaging & real-time monitoring – Clearly displays solder joints and enables instant alignment correction, ensuring precision and automated production.

4. Patented temperature feedback system – Directly controls solder joint temperature and displays real-time soldering temperature curves for optimal yield.

5. Four-in-one coaxial alignment (Laser + CCD + Temp. sensor + Guide light) – Solves multi-optical path alignment challenges in the industry, eliminating complex calibration.

6. High precision & speed – Achieves 0.2mm minimum solder joint diameter with >99% yield rate and ultra-fast soldering per joint.

7. X/Y/Z-axis flexibility – Adapts to soldering for a wider range of components.

8. Benchtop design – Compact and portable for easy mobility.

Applications:

• Microphones (MMICs)

• PCB components: Capacitors, resistors, pin headers, FPC cables, shielding covers, through-hole parts.

• Connectors: Electronic connectors, LED strips/bars, data cables, and small electronic components.