Solutions for Wire Feeding Jams in Laser Soldering Processes
In laser soldering, wire feeding mechanism jamming is a common issue that can severely impact production efficiently and product quality. Songsheng optoelectronic has summarized several solution.
Songsheng Optoelectronics Multi-Axis Wire Feeding & Guidance Mechanism with Welding Head Assembly Diagram
Check the quality of solder wire: Ensure the solder wire is bending, twisting, or surface damage, as these issue may cause jamming during feeding.
Clean the wire feeder: Regularly remove dirt, dust, and debris from the feeder’s interior and guide rails to maintain smooth wire feeding.
Adjust the wire feeding mechanism: Properly set the tension of the feeder, select the correct feed rollers, and ensure they match the diameter of the solder wire.
Lubricate key components: Applying appropriate lubrication to critical parts of the feeding mechanism can reduce friction and prevent jamming.
Inspect the drive system: Ensure the feeder motor operates at a stable speed and is undamaged. Replace the motor if necessary.
Regular maintenance and technical support: Conduct routine equipment maintenance and inspections, and consult the manufacturer’s technical support for professional guidance.
Address excessive feeding speed or improper positioning: If the wire feed speed is too high or the solder needle is too close to the welding head, insufficient time and heat may prevent proper melting, leading to clogging.
By implementing these measures, the issue of wire jamming in laser soldering can be effectively resolved, ensuring production efficiency and product quality.
Possible Causes of Wire Feeding Jams in Laser Soldering Systems:
Songsheng Optoelectronics Wire Feeding & Guidance Mechanism Detail Diagram
Improper Solder Wire Guidance Alignment:
Incorrect positioning of the solder wire during feeding may cause wire jamming. This typically occurs due to misadjusted wire guide positions or improper fixation of the solder feeding tube.
Excessive Wire Feeding Pressure:
Optimal feeding pressure is critical to prevent solder wire slippage or deformation. Overpressure may induce feeding abnormalities.
Substandard Solder Wire Quality:
Bent, twisted, or surface-damaged solder wire can directly contribute to jamming incidents.
Mechanical Actuation Component Failure:
Malfunctions in mechanical systems (e.g., wire feeding mechanism), including component wear or aging parts, may lead to wire jamming.
Bus Communication System Fault:
Failures in communication systems (e.g., teach pendant display modules) can indirectly cause wire feeding obstructions.
Solutions to address these issues include but are not limited to the following measures:
Adjustment of solder wire guiding position: Ensure the solder wire follows the correct guiding path during operation.
Optimization of wire feeding pressure: Maintain appropriate feeding pressure to prevent slippage or deformation caused by excessive pressure.
Analysis and preventive measures implementation: Improve production efficiency and product quality by analyzing failure causes and implementing corresponding solutions.
The specific causes of wire feeding jams in laser soldering systems may involve:
Improper solder wire guiding position
Inappropriate wire feeding pressure
Solder wire quality issues
Malfunctions in mechanical components
Failures in bus communication systems
Manufacturer's recommended solutions for wire feeding jams in laser soldering systems:
Songsheng Optoelectronics Desktop Temperature-Controlled Soldering System Diagram
Selecting Appropriate Wire Feeding Tube Length:
As longer tubes increase resistance, shorter tubes are recommended. For 0.8mm solder wire, a 3m tube optimizes feeding efficiency by reducing drag.
Inspecting the Wire Feeding Mechanism:
Conduct regular checks of all components to ensure proper operation, including verifying normal feeding torque and other performance-impacting factors.
Adjusting Wire Feeding Speed:
After activating the feeding mechanism, verify speed consistency and make necessary adjustments to maintain welding stability and efficiency.
Hose Length Considerations for Push-Type Systems:
Increased hose length reduces feeding stability - select lengths based on specific welding requirements and conditions.
Songsheng Optoelectronics' 3rd Gen Laser Temperature-Controlled Soldering System Features:
• 976nm direct semiconductor laser
• IR real-time thermometer
• Temperature-stabilized focusing head
• Automated wire feeding mechanism
• Single-focus annular illumination
• Intelligent temperature-control software
The system pre-sets multi-stage temperature profiles, with closed-loop laser control automatically reducing power when reaching upper limits to prevent thermal damage.
If issues persist after implementing these solutions:
Contact the equipment supplier or certified technicians for professional diagnosis and repair to avoid further damage.
Contact: Mr.Xiao
Phone: +86-13385280662
E-mail: market001@whlaser.cn
Add: Room 02, Floor 5, Building 9, Gezhouba Sun City, No. 40, Gaoxin 4th Road, Donghu New Technology Development Zone, Wuhan